Method of forming camera module for vehicular vision system

ABSTRACT

A method of forming a camera module for a vehicular vision system includes providing a circuit board and providing a lens holder for holding a lens assembly. A lens holder and circuit board construction is placed in a first mold and datumed in the first mold by a portion of the lens holder. An inner molded construction is formed by molding an inner molding over the circuit board and a portion of the lens holder. The inner molded construction is placed in a second mold and datumed in the second mold by the portion of the lens holder. An outer molded construction is formed by molding an outer molding over the inner molding and over another portion of the lens holder. The outer molded construction may include a connector portion that is configured to connect to a connector end of a vehicular wire harness.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 15/478,274, filed Apr. 4, 2017, now U.S. Pat. No. 10,142,532,which claims the filing benefits of U.S. provisional application Ser.No. 62/319,953, filed Apr. 8, 2016, which is hereby incorporated hereinby reference in its entirety.

FIELD OF THE INVENTION

The present invention relates generally to a vehicle vision system for avehicle and, more particularly, to a vehicle vision system that utilizesone or more cameras at a vehicle.

BACKGROUND OF THE INVENTION

Use of imaging sensors in vehicle imaging systems is common and known.Examples of such known systems are described in U.S. Pat. Nos.5,949,331; 5,670,935 and/or 5,550,677, which are hereby incorporatedherein by reference in their entireties. Various cameras have beenproposed for such imaging systems, including cameras of the typesdescribed in U.S. Pat. No. 7,965,336 and U.S. Publication No.US-2009-0244361, which are hereby incorporated herein by reference intheir entireties.

SUMMARY OF THE INVENTION

The present invention provides a vision system or imaging system for avehicle that utilizes one or more cameras (preferably one or more CMOScameras) to capture image data representative of images exterior of thevehicle. The camera comprises an imager and a circuit board (or circuitboards) and a lens. The printed circuit board (PCB) is overmolded via alow pressure molding process to form an overmolded circuit board that isdisposed at the lens and adjusted relative to the lens to focus and/oroptically align the lens at the imager. The lens and overmolded circuitboard construction is at least partially overmolded via a higherpressure molding process to form an outer shell for the camera, with theouter shell formed with a connector portion that provides the selectedor desired shape or form for electrical connection to a connector end ofa wire harness of the vehicle equipped with the camera. A particulartype of connector element (such as a coaxial connector element ormulti-pin connector element or the like) may be disposed at theconnecting terminals of the overmolded circuit board prior to theovermolding process that forms the outer shell, whereby the connectorportion is molded at and partially around the connector element toprovide the selected or desired connector for the particular cameraapplication.

The present invention thus provides a two shot overmolding process, andmay allow for various electrical connecting elements to be used, with asimplistic PCB stacking structure to minimize configurations, and with ahousing (either with or without electrical shielding). Optionally, thecamera may have an adjustable focus, whereby the imager is adjustablypositioned relative to the lens or lens assembly (and camera housing) toadjust the focus or focal length of the camera.

These and other objects, advantages, purposes and features of thepresent invention will become apparent upon review of the followingspecification in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a vehicle with a vision system thatincorporates cameras in accordance with the present invention;

FIG. 2 is an exploded schematic showing basic camera components;

FIG. 3 is a perspective view of a camera module of the presentinvention, shown with a digital signal connector portion;

FIGS. 4 and 5 are sectional views of the camera module of FIG. 3;

FIG. 6 is a perspective view of another camera module of the presentinvention, shown with an analog signal connector portion;

FIG. 7 is a perspective view of a connector side of the printed circuitboard, shown with NTSC connector elements suitable for the camera moduleof FIG. 6;

FIG. 8 is a perspective view of a connector side of the printed circuitboard, shown with NTSC connector elements suitable for the camera moduleof FIG. 3;

FIG. 9 is a perspective view of a lens holder or lens barrel portion ofthe camera module of the present invention;

FIG. 10 is a perspective view of an imager side of a printed circuitboard suitable for use with the camera module of the present invention;

FIG. 11 is another perspective view of the imager side of the printedcircuit board of FIG. 10, shown with adhesive disposed around the imagerfor attaching the printed circuit board at the lens holder;

FIG. 12 is a perspective view of the printed circuit board and lensholder assembly;

FIG. 13 is a side elevation of the printed circuit board and lens holderassembly of FIG. 12;

FIG. 14 is an enlarged area of the printed circuit board and lens holderassembly of FIG. 13;

FIGS. 15 and 16 are perspective views of the printed circuit board andlens holder assembly, as overmolded via a first molding process inaccordance with the present invention;

FIG. 17 is an end view showing of the overmolded printed circuit boardand lens holder assembly, showing the electrical connecting elements atthe circuit board and surrounded by an opening in the inner molding;

FIG. 18 is a perspective view of an NTSC connector elements configuredto electrically connect to the connecting elements at the circuit boardso as to provide a multi-pin connector at the connector portion of thecamera module;

FIG. 19 is a perspective view of the overmolded printed circuit boardand lens holder assembly, with the NTSC connecting elements disposed atthe opening in the inner molding so as to electrically connect at theconnecting elements at the circuit board;

FIG. 20 is a perspective view of an NTSC connector elements configuredto electrically connect to the connecting elements at the circuit boardso as to provide a pigtail type connection at the connector portion ofthe camera module;

FIG. 21 is a perspective view of the overmolded printed circuit boardand lens holder assembly, with the NTSC pigtail connecting elementsdisposed at the opening in the inner molding so as to electricallyconnect at the connecting elements at the circuit board;

FIG. 22 is a perspective view of the camera module of the presentinvention, shown with an outer shell molded over the inner molding ofthe printed circuit board and lens holder assembly in accordance withthe present invention;

FIG. 23 is a rear perspective view of the camera module of the presentinvention, shown with a non-EMI shielding shell;

FIG. 24 is a rear perspective view of the camera module of the presentinvention, shown with an EMI shielding shell;

FIG. 25 is a rear perspective view of the camera module of the presentinvention, shown with a pigtail connector shell;

FIG. 26 is a sectional view of the camera module of the presentinvention;

FIG. 27 is an enlarged sectional view of a portion of the camera moduleof FIG. 26;

FIG. 28 is a block diagram showing a process flow for manufacturing thecamera module of the present invention;

FIG. 29 is another block diagram showing another process flow formanufacturing the camera module of the present invention;

FIG. 30 is a perspective view of another camera module of the presentinvention, having a dual printed circuit board;

FIG. 31 is a perspective view of the stacked printed circuit boards andlens holder assembly of the camera module of FIG. 30, without the innermolding molded thereat;

FIG. 32 is a sectional view of the camera module of FIG. 30;

FIG. 33 is a schematic showing a camera module with an adjustablefocusing device in accordance with the present invention;

FIG. 34 is a perspective view of the circuit boards and focusing deviceof the camera module of FIG. 33;

FIG. 35 is a block diagram showing another process flow formanufacturing the camera module of the present invention;

FIG. 36 is a sectional view of another camera module of the presentinvention, having a circular printed circuit board; and

FIG. 37 shows views showing the circular printed circuit board andconnections for the camera module of FIG. 36.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A vehicle vision system and/or driver assist system and/or objectdetection system and/or alert system operates to capture images exteriorof the vehicle and may process the captured image data to display imagesand to detect objects at or near the vehicle and in the predicted pathof the vehicle, such as to assist a driver of the vehicle in maneuveringthe vehicle in a rearward direction. The vision system includes an imageprocessor or image processing system that is operable to receive imagedata from one or more cameras and provide an output to a display devicefor displaying images representative of the captured image data.Optionally, the vision system may provide display, such as a rearviewdisplay or a top down or bird's eye or surround view display or thelike.

Referring now to the drawings and the illustrative embodiments depictedtherein, a vehicle 10 includes an imaging system or vision system 12that includes at least one exterior facing imaging sensor or camera,such as a rearward facing imaging sensor or camera 14 a (and the systemmay optionally include multiple exterior facing imaging sensors orcameras, such as a forwardly facing camera 14 b at the front (or at thewindshield) of the vehicle, and a sidewardly/rearwardly facing camera 14c, 14 d at respective sides of the vehicle), which captures imagesexterior of the vehicle, with the camera having a lens for focusingimages at or onto an imaging array or imaging plane or imager of thecamera (FIG. 1). Optionally, a forward viewing camera may be disposed atthe windshield of the vehicle and view through the windshield andforward of the vehicle, such as for a machine vision system (such as fortraffic sign recognition, headlamp control, pedestrian detection,collision avoidance, lane marker detection and/or the like). The visionsystem 12 includes a control or electronic control unit (ECU) orprocessor 18 that is operable to process image data captured by thecamera or cameras and may detect objects or the like and/or providedisplayed images at a display device 16 for viewing by the driver of thevehicle (although shown in FIG. 1 as being part of or incorporated in orat an interior rearview mirror assembly 20 of the vehicle, the controland/or the display device may be disposed elsewhere at or in thevehicle). The data transfer or signal communication from the camera tothe ECU may comprise any suitable data or communication link, such as avehicle network bus or the like of the equipped vehicle.

As shown in FIG. 2, a camera module comprises a lens or light gatheringsystem (which may be disposed in a lens barrel or lens holder), animager or device that converts light to electrical signals for datainterpolation (such as disposed on a printed circuit board withassociated circuitry), and an electrical connector for electricallyconnecting the circuitry and imager to a vehicle connector when thecamera is disposed at the vehicle. Preferably, the vehicle camera shouldbe compact in size with reduced components, and with reduced cost andshort or reduced manufacturing cycle times. The vehicle camera shouldalso provide scalable architecture and customer independent technology(such as direct connect, pigtail connector, brackets and/or the like) sothat the camera is readily adaptable for different applications. Thepresent invention provides a camera module that meets these criteria byproviding a lower pressure molding over the circuit board and circuitry,and then a higher pressure injection molding over the low pressuremolding and over part of the lens holder and over part of the connectingelements, as discussed below.

As shown in FIGS. 3-5, a camera module 14 of the present inventioncomprises a two shot molded housing, which includes an inner lowpressure molding or first shot polymer 22 (that is molded over thecircuit board 23 and circuitry and a portion of the lens holder) and anouter high pressure injecting molding or shell or second shot polymer 24that is molded over the inner molding 22 and over a portion of the lensholder 26. The present invention thus utilizes advanced moldingtechniques coupled with traditional polymers modified as needed forincreased thermal performance.

In the illustrated embodiment of FIGS. 3-5, the camera module outputs adigital signal and has a coaxial spring connector element 28 insertmolded at a connector portion 24 a of the outer molding 24. Optionally,and such as shown in FIG. 6, the camera module may output an analogsignal and may have an analog or multi-pin connector element insertmolded at the connector portion of the outer molding, as discussedbelow. Camera modules made for either application will use the samerespective printed circuit board or PCB. For example, and as can be seenin FIGS. 7 and 8, an analog camera application may utilize an NTSC(National Television System Committee) version of the PCB (FIG. 7),which includes multiple connecting elements for electrically connectingto the pins of the multi-pin connector element, while a digital cameraapplication may utilize a low voltage differential signaling (LVDS)version of the PCB (FIG. 8), which includes a coaxial connecting elementfor electrically connecting to the coaxial connector element.

During assembly of the camera module, the PCB (FIG. 10) with the imagerdisposed thereat, is positioned at the lens holder or lens barrel (FIG.9), and a bead of adhesive 30 (FIG. 11) may be disposed at the PCB 23.The PCB and lens holder may be plasma treated before the adhesive isapplied to provide the benefit of a cleaning the imager surface. Asshown in FIGS. 12-14, the PCB is then adhered to the lens holder, andthe lens is centered and optically aligned at the imager, and theadhesive is at least initially cured to hold the lens relative to thePCB and in optical alignment with the imager. The adhesive and aligningand curing processes may utilize aspects of the systems and methodsdescribed in U.S. Pat. Nos. 8,542,451 and 9,277,104, which are herebyincorporated herein by reference in their entireties.

After the lens is optically aligned with the imager and the adhesive isat least initially cured, the lens barrel and PCB construction (seeFIGS. 12 and 13) is placed in a low pressure mold and the part isdatumed in the tooling by the lens or lens barrel, whereby the firstshot polymer 22 is insert molded onto and over and around the PCB, suchas with a thermally conductive TECHNOMELT® (low pressure polyamide (PA)adhesive), such as is commercially available from Henkel ElectronicsMaterials LLC of Irvine, Calif. Such a low pressure moldable polyamidemay be moldable or applied at between around 200 degrees C. and 240degrees C. The low pressure moldable polyamide comprises a low-viscositymaterial that allows for low injection pressures so as to mold over thecircuitry without damaging the circuitry or PCB, and the selectedmaterial may adhere to the circuit board to form a bond all around theboard and circuitry so as to seal the circuit board within the innermolded portion or first shot polymer.

Examples of suitable materials for the first shot mold material includeTECHNOMELT® 646 and Raschig thermoset EPDXIDUR® series 3585, 3162, and3581. The first shot mold material optionally and preferably molds at apressure of less than about 500 psi, such as at a pressure less thanabout 300 psi, such as at a pressure between about 100 psi and about 300psi, or optionally at a pressure of between about 50 psi and about 150psi. For example, TECHNOMELT PA 646(e) provides a high performancethermoplastic polyamide that is designed to meet low pressure moldingprocess requirements, and can be processed at low processing pressuredue to its low viscosity, allowing encapsulation of fragile componentswithout damage. This material produces no toxic fumes during the moldingprocess and provides a good balance of low and high temperatureperformance.

The molded inner molding 22 has a rear portion or receiving portion 22 athat is open to expose the connecting elements at the PCB (shown in FIG.17 as multiple pads or connecting elements for a multi-pin connector).As shown in FIGS. 18 and 19, an electrical connector element 32 (such asan NTSC direct connect multi-pin element or a spring-loaded coaxialconnector or a multi-pin pigtail connector element, depending on theparticular application of the camera) is disposed at the opening so asto electrically connect to the connecting elements at the PCB and tohave connecting elements or terminals disposed outside of the innermolding. The connector element may be plugged into the opening orreceiving portion 22 a of the inner molding 22 (and electrically connectto circuitry or a header connector at the PCB) after the inner moldingis at least partially cured and before the outer shell is molded overthe inner molding and connector element. Optionally, and such as shownin the illustrated embodiment of FIGS. 18 and 19, the multiple pins orterminals may comprise spring-loaded pins to allow for the pins toengage and be biased toward the connecting elements at the PCB when theconnector is pressed into the aperture of the inner molding. Optionallyand such as shown in FIGS. 20 and 21, a multi-pin pigtail connectorelement 32′ (optionally having spring-loaded pins) may be provided for apigtail type connector for the camera module.

As shown in FIGS. 22 and 23, the outer shell or second shot polymer 24is insert molded onto the first shot polymer and lens barrel, such as byusing the same datums at the lens barrel as were used for the first shotmolding. The molded camera housing thus has little or no packagingtolerances, and is formed with a hard or rigid outer plastic shell. Asshown in FIG. 23, the outer shell includes a connector portion moldedover and around the connecting element disposed at the aperture of theinner molding, with the connector portion providing the desired shapeand connecting feature for electrically connecting the camera module toa wire harness of the vehicle or the like. Optionally, and such as shownin FIG. 24, an EMI shielding shell may be overmolded to provide agrounding terminal or shielding terminal 24 b of the connector 24 a.Optionally, and as shown in FIG. 25, the same process can form a pigtailconnector with just a different rear half of the second shot tool ormold.

The outer shell material may comprise any suitable polymer, such as, forexample, a thermally conductive polycarbonate, such as of the typeavailable from Celanese. The outer shell material comprises a moldablepolymeric material that, when cured or hardened, provides a durable hardor rigid outer plastic shell for the camera. The material or materialsselected for the outer shell material are molded at a higher pressurethan the inner or first shot polymer. For example, the outer shellmaterial may be injection molded around the first shot polymer atpressure over around 4,000 psi, or greater than around 6,000 psi, suchas, for example, around 8,000 psi.

Thus, the system and method of the present invention can provide variouscameras with different electrical connectors at a molded body thatprovides reduced tolerances and smaller sizes for the cameras (FIG. 26shows some exemplary dimensions of a camera module of the presentinvention). The PCB 23 is completely encased in the first shot polymer22, and no air volume is around the PCB components and circuitry, whichmakes it difficult for moisture affects and for tin whiskers to grow.The second shot polymer 24 is injected into the tool and the hot polymerwill melt a tip feature 26 a (FIG. 27) of the lens barrel 26 to create ahermetic seal between the second shot polymer or shell 24 and the lensbarrel 26.

The present invention thus provides enhanced processing and forming ofthe camera module. Exemplary processes for making cameras of the presentinvention are shown in FIGS. 28 and 29. As can be seen in FIGS. 28 and29, the processes include an aligning station, where the lens barrel isattached at the PCB and the adhesive is cured, and include a first shotmold machine that molds the inner molding at the PCB, and include asecond shot mold machine that molds the outer molding or shell over theinner molding. The connector element may be inserted into the receivingportion of the inner molding (to electrically connect to the circuitryof the circuit board) within the inner molding after the inner moldingis molded and before the outer molding or shell is molded.

Thus, the system or process or camera of the present invention has afirst shot material molded over the circuit board and circuitry andportion of the lens barrel that is at or adhered to the circuit board tofully encase the circuit board. For example, the first shot material maycomprise a glass-fiber reinforced and inorganically filled epoxy moldingcompound, such as a low pressure molded thermoset material (such asRaschig's EPDXIDUR® EP 3581) that has good mechanical strength (whencured) and very good electrical isolation properties and dimensionalstability even at high temperatures. The first shot material may bemolded at a first molding pressure of less than around 1,000 psi,preferably less than around 500 psi, such as less than around 300 psi.

During the first shot molding process, the connector pads or circuitryor header at the circuit board (that are to electrically connect to theterminals of the connector element) are not molded over so that they areexposed after the first shot molding is completed. Such exposure can beprovided by the mold itself, which may have a mold wall or insertelement that is placed at and over the connector pads or header duringthe first shot molding process and then removed before the second shotmolding process. The mold wall also forms the receiving portion at therear of the inner molding so that the inner molding is configured toreceive the electrical connector element therein prior to the secondshot molding process.

The second shot molding process molds the second material over theelectrical connector element that is disposed at the connector pads orheader after the first shot molding process is completed, and over thefirst shot or inner molding and over an additional part of the lensholder. The second shot material provides a hard protective shell overthe inner molding. The second shot material is molded at a secondmolding pressure that may be greater than around 5,000 psi, such asaround 8,000 psi or thereabouts. The second shot material need not havegood electrical isolation properties since it is not in contact with anyelectrical circuitry or the like.

By providing the electrical connector element after the first shotmolding is completed, the mold for the first shot may comprise auniversal mold that molds over various circuit boards and lens holders,such as a circuit board for connection to a multi-pin connector or to apigtail connector. After the first shot molding is complete, theappropriate or selected connector element is plugged into the receivingportion of the first shot and electrically connected to the circuitry orheader at the circuit board. The second shot molding then may providethe desired overmolding and connector portion for the particularapplication of that camera (e.g., multi-pin connector or pigtailconnector or the like).

Optionally, it is envisioned that the camera may be formed by molding asingle material over the circuit board and portion of the lens holder,with that single material providing the outer shell as well as theencapsulation of the circuit board. For example, the Raschig thermosetmaterial may be used by itself to overmold the circuit board and toprovide the outer shell of the camera. In such an application, thethermoset material is injection molded over and around the circuit boardand portion of the lens holder, and may also be injection molded arounda connector element protruding from electrical contacts at the circuitboard. The molding is formed to provide the electrical connector forconnecting to a connector of a vehicle wire harness. The connectorelement may be plugged into a header connector at the circuit board ormay be soldered at the circuit board before the molding is injectionmolded over and around the circuit board and portion of the lens holder.The mold is configured to form the electrical connector (such as a plugor socket type connector) at and around the connector element, such aswith a wall or portion of the mold engaging the outer end of theconnector element to limit or preclude the molten material fromintrusion at the connector during the low pressure molding process.

The single shot molding may be injection molded at a low pressure (suchas less than 500 psi, such as less than 200 psi or thereabouts), and canrapidly cure (in about 45 seconds or less) to a hardened state, wherethe molding protects and encapsulates the circuit board and circuitryand that also provides a hard outer shell of the camera. Optionally, asecond shot molding may be provided over the molding, where the secondshot may comprise injection molding of a higher pressure material (suchas discussed above) or may comprise injection molding of the same lowpressure material or a different low pressure material to provide thedesired outer surface and configuration of the camera module.

The present invention thus eliminates some processes, such as laserwelding, screw installation, thermal paste dispensing, leak testing,bracket alignment, special end of arm tooling and cure tooling for sideby side PCBs, and assembly of flex cable. The present invention addssome processes, such as low pressure molding, high pressure injectionmolding, assembly to a carrier for two or more PCBs, assembly of a pinconnecting element, and assembly of a foam gasket to the camera (if thecamera is for a sealed application). However, the additional processesprovide benefits, such as reduced size and cost and processing time (byeliminating the other processes above), such that the present inventionprovides an improved camera module for vehicles.

For example, the camera module of the present invention provides reducedcost and has a reduced package density ratio—best use of camera space.Also, there is little or no risk of laser weld joint leaking, and thereare little to no packaging tolerances—and no additional clearance neededaround lens or rear cover. The camera module of the present inventiondoes not require rigid flex for two-PCB cameras but can be used ifdesired in short C bend. The present invention eliminates therequirement of dispensing of thermal paste. The sub-assembly isprotected from dust/debris/outgassing prior to molding. Capital costsfor tooling are reduced, such as by up to about 50 percent. Also, theprocess of the present invention only requires one tool instead ofseparate tools for the lens holder and rear cover. With the process ofthe present invention, there is potential for full automated assembly,with significant reduction in labor costs. The process will works withany lens, any PCB, any connector, any exit direction, and both NTSC andLVDS. With careful design and forethought, the first shot tooling couldbe platform specific based on the PCB. There is no internal volume ofair inside, which lowers pressure differentials and reduces moistureconcerns and eliminates tin whisker concerns as well as the associatedvalidation testing. The present invention provides for perfect or nearperfect dimensional form, which allows for mounting features to be addedto the camera housing for vehicle packaging. The molded camera module ofthe present invention also provides enhanced or optimal heat transfer.

Additionally, there will be lower warranty returns for the cameras,simplified quoting responses, fewer camera assemblies and parts for thesuppliers to track. The technology of the two shot molded camera couldbe implemented for forward facing camera products as well. The camerashave common manufacturing architecture for easier implementation andcontrol globally. All of the lens holders are opaque so there are littleto no light bleeding issues. The cameras have the same dimensionalperformance for all cameras, and there is no need for a special polymerwith laser transmission properties for the lens holder.

Optionally, the camera module may comprise two PCBs or a multi-boardstack, whereby the inner molding is molded over and around and betweentwo PCBs, such as shown in FIGS. 30-32. The processes and materials usedto mold an inner lower pressure molding over and around and between thetwo PCBs and portion of the lens holder and to mold an outer shell overand around the inner molding and connector element and portion of thelens holder may be substantially similar to the processes and materialsdiscussed above, such that a detailed discussion of the processes andmaterials need not be repeated herein.

Optionally, the camera module may include an adjustable focus feature,such as by utilizing a micro electro-mechanical system (MEMS). Forexample, the camera may include a control device in the housing thatreceives a controlling signal (such as responsive to a user input or anautomatic control signal or the like) and adjusts a position of theimager relative to the lens to establish the desired or selected orappropriate focus or focal length of the camera, such as by utilizingaspects of the cameras described in U.S. Publication No.US-2017-0048463, which is hereby incorporated herein by reference in itsentirety. Such a system is shown in FIGS. 33 and 34. Also, an exemplaryprocess flow chart for manufacturing a two shot molded camera with MEMSis shown in FIG. 35. The result of such a camera would be a low costcamera with enhanced performance and with reduced mechanical andvalidation resources and with a mechanical platform fit for evolvingthrough generations of electrical architecture evolution.

Optionally, the camera module may be formed with a smaller circularshaped PCB or PCBs, such as shown in FIGS. 36 and 37. Such a cameraconstruction has smaller, round PCBs (such as having diameters of about14 mm and 17 mm or thereabouts), and changes to voltage regulator andLVDS filter components. The circuit board is electrically connected tocircuitry or conductive traces of the camera housing, with theconductive traces comprising molded interconnect (MID) devices. The MIDelectrically conductive elements or traces are board-to-board (B2B)connections, and electrical connection is from the side of the cameraand in-line with the PCB structure. The image signal processing may bedone outside of the camera. The camera may utilize aspects of thecameras described in U.S. Publication No. US-2016-0037028, which ishereby incorporated herein by reference in its entirety.

Thus, the present invention provides enhanced camera modulemanufacturing by using a two shot molding process, with a first lowpressure molding to seal the PCB with the PCB aligned and fixed relativeto the lens barrel, and a second higher pressure injection molding tosurround or encase the inner molding with a rigid or hard plastic shell,which is formed with a desired electrical connector configuration forconnecting to the connector end of a vehicle wire harness at the vehicleat which the camera will be installed.

The camera module may utilize aspects of the cameras and connectorsdescribed in U.S. Pat. Nos. 9,077,098; 8,994,878 and/or 7,965,336,and/or U.S. Publication Nos. US-2009-0244361; US-2013-0242099;US-2014-0373345; US-2015-0222795; US-2016-0243987 and/orUS-2016-0268716, and/or U.S. patent application Ser. No. 15/467,246,filed Mar. 23, 2017 and published Jul. 13, 2017 as U.S. Publication No.US-2017-0201661, and/or Ser. No. 15/341,048, filed Nov. 2, 2016 andpublished May 11, 2017 as U.S. Publication No. US-2017-0133811, and/orU.S. provisional application Ser. No. 62/403,456, filed Oct. 3, 2016,which are hereby incorporated herein by reference in their entireties.

The camera or sensor may comprise any suitable camera or sensor.Optionally, the camera may comprise a “smart camera” that includes theimaging sensor array and associated circuitry and image processingcircuitry and electrical connectors and the like as part of a cameramodule, such as by utilizing aspects of the vision systems described inInternational Publication Nos. WO 2013/081984 and/or WO 2013/081985,which are hereby incorporated herein by reference in their entireties.

The system includes an image processor operable to process image datacaptured by the camera or cameras, such as for detecting objects orother vehicles or pedestrians or the like in the field of view of one ormore of the cameras. For example, the image processor may comprise animage processing chip selected from the EYEQ™ family of image processingchips available from Mobileye Vision Technologies Ltd. of Jerusalem,Israel, and may include object detection software (such as the typesdescribed in U.S. Pat. Nos. 7,855,755; 7,720,580 and/or 7,038,577, whichare hereby incorporated herein by reference in their entireties), andmay analyze image data to detect vehicles and/or other objects.Responsive to such image processing, and when an object or other vehicleis detected, the system may generate an alert to the driver of thevehicle and/or may generate an overlay at the displayed image tohighlight or enhance display of the detected object or vehicle, in orderto enhance the driver's awareness of the detected object or vehicle orhazardous condition during a driving maneuver of the equipped vehicle.

The vehicle may include any type of sensor or sensors, such as imagingsensors or radar sensors or lidar sensors or ladar sensors or ultrasonicsensors or the like. The imaging sensor or camera may capture image datafor image processing and may comprise any suitable camera or sensingdevice, such as, for example, a two dimensional array of a plurality ofphotosensor elements arranged in at least 640 columns and 480 rows (atleast a 640×480 imaging array, such as a megapixel imaging array or thelike), with a respective lens focusing images onto respective portionsof the array. The photosensor array may comprise a plurality ofphotosensor elements arranged in a photosensor array having rows andcolumns. Preferably, the imaging array has at least 300,000 photosensorelements or pixels, more preferably at least 500,000 photosensorelements or pixels and more preferably at least 1 million photosensorelements or pixels. The imaging array may capture color image data, suchas via spectral filtering at the array, such as via an RGB (red, greenand blue) filter or via a red/red complement filter or such as via anRCC (red, clear, clear) filter or the like. The logic and controlcircuit of the imaging sensor may function in any known manner, and theimage processing and algorithmic processing may comprise any suitablemeans for processing the images and/or image data.

For example, the vision system and/or processing and/or camera and/orcircuitry may utilize aspects described in U.S. Pat. Nos. 9,233,641;9,146,898; 9,174,574; 9,090,234; 9,077,098; 8,818,042; 8,886,401;9,077,962; 9,068,390; 9,140,789; 9,092,986; 9,205,776; 8,917,169;8,694,224; 7,005,974; 5,760,962; 5,877,897; 5,796,094; 5,949,331;6,222,447; 6,302,545; 6,396,397; 6,498,620; 6,523,964; 6,611,202;6,201,642; 6,690,268; 6,717,610; 6,757,109; 6,802,617; 6,806,452;6,822,563; 6,891,563; 6,946,978; 7,859,565; 5,550,677; 5,670,935;6,636,258; 7,145,519; 7,161,616; 7,230,640; 7,248,283; 7,295,229;7,301,466; 7,592,928; 7,881,496; 7,720,580; 7,038,577; 6,882,287;5,929,786 and/or 5,786,772, and/or U.S. Publication Nos.US-2014-0340510; US-2014-0313339; US-2014-0347486; US-2014-0320658;US-2014-0336876; US-2014-0307095; US-2014-0327774; US-2014-0327772;US-2014-0320636; US-2014-0293057; US-2014-0309884; US-2014-0226012;US-2014-0293042; US-2014-0218535; US-2014-0218535; US-2014-0247354;US-2014-0247355; US-2014-0247352; US-2014-0232869; US-2014-0211009;US-2014-0160276; US-2014-0168437; US-2014-0168415; US-2014-0160291;US-2014-0152825; US-2014-0139676; US-2014-0138140; US-2014-0104426;US-2014-0098229; US-2014-0085472; US-2014-0067206; US-2014-0049646;US-2014-0052340; US-2014-0025240; US-2014-0028852; US-2014-005907;US-2013-0314503; US-2013-0298866; US-2013-0222593; US-2013-0300869;US-2013-0278769; US-2013-0258077; US-2013-0258077; US-2013-0242099;US-2013-0215271; US-2013-0141578 and/or US-2013-0002873, which are allhereby incorporated herein by reference in their entireties. The systemmay communicate with other communication systems via any suitable means,such as by utilizing aspects of the systems described in InternationalPublication Nos. WO/2010/144900; WO 2013/043661 and/or WO 2013/081985,and/or U.S. Pat. No. 9,126,525, which are hereby incorporated herein byreference in their entireties.

Changes and modifications in the specifically described embodiments canbe carried out without departing from the principles of the invention,which is intended to be limited only by the scope of the appendedclaims, as interpreted according to the principles of patent lawincluding the doctrine of equivalents.

The invention claimed is:
 1. A method of forming a camera module for avision system for a vehicle, said method comprising: providing a circuitboard, wherein the circuit board has an imager and associated circuitrydisposed thereat; providing a lens holder for holding a lens assembly,the lens assembly including a plurality of optical elements; disposingan adhesive in an uncured state at one or both of the lens holder andthe circuit board; positioning the lens holder at the circuit board withthe uncured adhesive disposed between and contacting the lens holder andthe circuit board; optically aligning the plurality of optical elementswith the imager at the circuit board; with the plurality of opticalelements optically aligned with the imager at the circuit board, andwith the adhesive between and contacting the lens holder and the circuitboard, forming a lens holder and circuit board construction by curingthe adhesive to an at least partially cured state to secure the lensholder relative to the circuit board; with the adhesive cured to the atleast partially cured state, placing the lens holder and circuit boardconstruction in a first mold, wherein, when placing the lens holder andcircuit board construction in the first mold, the lens holder andcircuit board construction is datumed in the first mold by a portion ofthe lens holder; forming an inner molded construction by molding, usinga first polymeric resin, an inner molding over and around the circuitboard and over a portion of the lens holder; placing the inner moldedconstruction in a second mold, wherein, when placing the inner moldedconstruction in the second mold, the inner molded construction isdatumed in the second mold by the portion of the lens holder; andforming an outer molded construction by molding, using a secondpolymeric resin, an outer molding over the inner molding and overanother portion of the lens holder to encase the inner molding.
 2. Themethod of claim 1, wherein the molding pressure in the first mold whenmolding the inner molding is lower than the molding pressure in thesecond mold when molding the second molding.
 3. The method of claim 1,wherein the first mold and the second mold are the same mold, andwherein molding the inner molding comprises molding the inner molding ina first shot of a two-shot molding process, and wherein molding theouter molding comprises molding the outer molding in a second shot ofthe two-shot molding process.
 4. The method of claim 1, wherein formingthe inner molded construction comprises molding the first polymericresin at a first molding pressure that is less than 500 psi.
 5. Themethod of claim 4, wherein forming the outer molded constructioncomprises injection molding the second polymeric resin at a moldingpressure that is greater than 5,000 psi.
 6. The method of claim 1,wherein the first polymeric resin comprises a thermally conductive hotmelt adhesive.
 7. The method of claim 1, wherein the first polymericresin comprises a polyamide.
 8. The method of claim 1, wherein formingthe inner molded construction comprises molding the first polymericresin at a first molding temperature that is no more than 240 degreesCelsius.
 9. The method of claim 1, wherein the circuit board has theimager disposed at one side of the circuit board and wherein electricalconnecting elements are disposed at an opposing side of the circuitboard that is separated from the one side by a thickness of the circuitboard.
 10. The method of claim 1, wherein forming the outer moldedconstruction comprises molding a connector portion that is configured toconnect to a connector end of a vehicular wire harness to electricallyconnect the connector end of the vehicular wire harness to electricalconnecting elements at the circuit board.
 11. The method of claim 10,comprising providing, before forming the outer molded construction, aconnector element at the inner molded construction that, when provided,is in electrical connection with the electrical connecting elements atthe circuit board, wherein molding the connector portion comprisesmolding a connector portion that at least partially surrounds theconnector element, and wherein, after forming the outer moldedconstruction, the connector portion is configured to connect to theconnector end of the vehicular wire harness to electrically connect theconnector end of the vehicular wire harness to the connector element toestablish electrical connection between the vehicular wire harness andthe electrical connecting elements at the circuit board.
 12. The methodof claim 11, wherein the electrical connecting elements at the circuitboard comprise a plurality of electrically conductive pads electricallyconnected to circuitry at the circuit board, and wherein providing theconnector element comprises providing a connector element having aplurality of electrically conductive terminals that electrically connectto the electrically conductive pads when the connector element isprovided at the inner molded construction.
 13. The method of claim 11,wherein providing the connector element comprises press fitting theconnector element into a receiving structure of the inner moldedconstruction to electrically connect the connector element to theelectrically connecting elements at the circuit board.
 14. The method ofclaim 10, comprising providing, before forming the outer moldedconstruction, a coaxial connector element at the inner moldedconstruction that, when provided, is in electrical connection with theelectrical connecting elements at the circuit board, wherein molding theconnector portion comprises molding a coaxial connector portion that atleast partially surrounds the coaxial connector element, and wherein,after forming the outer molded construction, the coaxial connectorportion is configured to connect to a coaxial connector end of thevehicular wire harness to electrically connect the coaxial connector endof the vehicular wire harness to the coaxial connector element toestablish electrical connection between the vehicular wire harness andthe electrical connecting elements at the circuit board.
 15. The methodof claim 14, wherein providing the coaxial connector element comprisespress fitting the coaxial connector element into a receiving structureof the inner molded construction to electrically connect the coaxialconnector element to the electrically connecting elements at the circuitboard.
 16. The method of claim 14, wherein providing the circuit boardcomprises providing a circuit board having circuitry that outputs adigital signal via the coaxial connector element utilizing low voltagedifferential signaling.
 17. The method of claim 1, wherein forming theouter molded construction comprises injection molding the secondpolymeric resin over a tip feature of the lens holder, and wherein, whenthe second polymeric resin is heated and injection molded, the tipfeature melts and bonds with the second polymeric resin to create ahermetic seal between the outer molding and the lens holder.
 18. Amethod of forming a camera module for a vision system for a vehicle,said method comprising: providing a circuit board, wherein the circuitboard has an imager and associated circuitry disposed thereat; providinga lens holder for holding a lens assembly, the lens assembly including aplurality of optical elements; disposing an adhesive in an uncured stateat one or both of the lens holder and the circuit board; positioning thelens holder at the circuit board with the uncured adhesive disposedbetween and contacting the lens holder and the circuit board; opticallyaligning the plurality of optical elements with the imager at thecircuit board; with the plurality of optical elements optically alignedwith the imager at the circuit board, and with the adhesive between andcontacting the lens holder and the circuit board, forming a lens holderand circuit board construction by curing the adhesive to an at leastpartially cured state to secure the lens holder relative to the circuitboard; with the adhesive cured to the at least partially cured state,placing the lens holder and circuit board construction in a first mold,wherein, when placing the lens holder and circuit board construction inthe first mold, the lens holder and circuit board construction isdatumed in the first mold by a portion of the lens holder; forming aninner molded construction by molding, using a first polymeric resin, aninner molding over the circuit board and over a portion of the lensholder; wherein molding the inner molding comprises molding the innermolding at a first molding pressure in the first mold; wherein formingthe inner molded construction comprises molding the first polymericresin at a first molding temperature that is no more than 240 degreesCelsius; placing the inner molded construction in a second mold,wherein, when placing the inner molded construction in the second mold,the inner molded construction is datumed in the second mold by theportion of the lens holder; forming an outer molded construction bymolding, using a second polymeric resin, an outer molding over the innermolding and over another portion of the lens holder to encase the innermolding; wherein molding the outer molding comprises molding the outermolding at a second molding pressure in the second mold; and wherein thefirst molding pressure is lower than the second molding pressure. 19.The method of claim 18, wherein the first mold and the second mold arethe same mold, and wherein molding the inner molding comprises moldingthe inner molding in a first shot of a two-shot molding process, andwherein molding the outer molding comprises molding the outer molding ina second shot of the two-shot molding process.
 20. The method of claim18, wherein forming the inner molded construction comprises molding thefirst polymeric resin at a first molding pressure that is less than 500psi.
 21. The method of claim 20, wherein forming the outer moldedconstruction comprises injection molding the second polymeric resin at amolding pressure that is greater than 5,000 psi.
 22. The method of claim18, wherein the first polymeric resin comprises a thermally conductivehot melt adhesive.
 23. The method of claim 18, wherein the firstpolymeric resin comprises a polyamide.
 24. The method of claim 18,wherein forming the outer molded construction comprises molding acoaxial connector portion that is configured to connect to a coaxialconnector end of a coaxial vehicular wire harness to electricallyconnect the coaxial connector end of the coaxial vehicular wire harnessto electrical connecting elements at the circuit board.
 25. A method offorming a camera module for a vision system for a vehicle, said methodcomprising: providing a circuit board, wherein the circuit board has animager and associated circuitry disposed thereat; providing a lensholder for holding a lens assembly, the lens assembly including aplurality of optical elements; disposing an adhesive in an uncured stateat one or both of the lens holder and the circuit board; positioning thelens holder at the circuit board with the uncured adhesive disposedbetween and contacting the lens holder and the circuit board; opticallyaligning the plurality of optical elements with the imager at thecircuit board; with the plurality of optical elements optically alignedwith the imager at the circuit board, and with the adhesive between andcontacting the lens holder and the circuit board, forming a lens holderand circuit board construction by curing the adhesive to an at leastpartially cured state to secure the lens holder relative to the circuitboard; with the adhesive cured to the at least partially cured state,placing the lens holder and circuit board construction in a first mold,wherein, when placing the lens holder and circuit board construction inthe first mold, the lens holder and circuit board construction isdatumed in the first mold by a portion of the lens holder; forming aninner molded construction by molding, using a first polymeric resin, aninner molding over the circuit board and over a portion of the lensholder; wherein forming the inner molded construction comprises at leastone selected from the group consisting of (i) molding the firstpolymeric resin at a first molding temperature that is no more than 240degrees Celsius and (ii) molding the first polymeric resin at a firstmolding pressure that is less than 500 psi; wherein forming the innermolded construction includes providing a coaxial connector element thatis, when provided, in electrical connection with electrical connectingelements at the circuit board; placing the inner molded construction ina second mold, wherein, when placing the inner molded construction inthe second mold, the inner molded construction is datumed in the secondmold by the portion of the lens holder; forming an outer moldedconstruction by molding, using a second polymeric resin, an outermolding over the inner molding and over another portion of the lensholder to encase the inner molding; wherein forming the outer moldedconstruction comprises molding a coaxial connector portion over at leastpart of the coaxial connector element; and wherein the molded coaxialconnector portion is configured to connect to a coaxial connector end ofa coaxial vehicular wire harness to electrically connect the coaxialconnector end of the coaxial vehicular wire harness to the coaxialconnector element to establish electrical connection between the coaxialvehicular wire harness and the electrical connecting elements at thecircuit board.
 26. The method of claim 25, wherein the molding pressurein the first mold when molding the inner molding is lower than themolding pressure in the second mold when molding the second molding. 27.The method of claim 25, wherein the first mold and the second mold arethe same mold, and wherein molding the inner molding comprises moldingthe inner molding in a first shot of a two-shot molding process, andwherein molding the outer molding comprises molding the outer molding ina second shot of the two-shot molding process.
 28. The method of claim25, wherein providing the coaxial connector element comprises pressfitting the coaxial connector element into a receiving structure of theinner molded construction to electrically connect the coaxial connectorelement to the electrically connecting elements at the circuit board.29. The method of claim 25, wherein forming the inner moldedconstruction comprises molding the first polymeric resin at a firstmolding pressure that is less than 500 psi and at a first moldingtemperature that is no more than 240 degrees Celsius.
 30. The method ofclaim 29, wherein forming the outer molded construction comprisesinjection molding the second polymeric resin at a molding pressure thatis greater than 5,000 psi.
 31. The method of claim 25, wherein the firstpolymeric resin comprises a thermally conductive hot melt adhesive. 32.The method of claim 25, wherein the first polymeric resin comprises apolyamide.